Modular mobiles could be the future of the smartphone world. Motorola has been working on it for some time now, and their partnership with Phoneblocks (also known as Phonebloks), who have already come a long way, shows that it's very important to them to bring this project to fruition. In fact, they attach such importance to it that they already have the first prototype of this modular phone.
And no, unfortunately we cannot tell you what this prototype is like, since at the moment we know nothing about it, except for its very existence, and all thanks to the confirmation of Motorola CEO Dennis Woodside. However, the fact that they're already working on a prototype is truly encouraging. It not only shows that they care about it, but much more. It's not simply an idea that might one day become a reality; it's already a reality, and creating a modular phone is feasible, although there's still a lot of room for improvement. Typically, the possible improvement for the future it's the easiest thing.
Motorola has been working on customizable phones for a long time. The Motorola Moto X already allowed users to choose the material used to make some cases, as well as a variety of elements that could be selected in different colors. However, before this, there was already talk that The Americans were interested in launching the customizable smartphone, in which users could choose the processor they wanted, the camera, the screen, the RAM, the battery, etc.
Motorola Ara is the project that could make this a reality. But not with the idea of ​​allowing users to choose which components they want in their phone when they buy it, but rather with the idea of ​​making the phone completely modular. That even a user can select that same day which modules you want to carry on your phone throughout the day.
It is positive that a prototype of this mobile already exists, although it is most likely that let's not watch anything commercial of this type immediatelyThe priority is to mature the platform, the module ecosystem, and the certification process.
Project Ara: open and modular platform
Motorola's proposal with Google was called Project Ara: an open hardware platform with the goal of replicating in hardware what Android achieved in software, creating an ecosystem of developers capable of accelerating innovation, reducing barriers to entry, and allowing third parties to design and manufacture modules. The idea: that anyone can configure their phone at the component level and upgrade it piece by piece.
To boost community, Motorola/Google planned a Module Developer's Kit (MDK) that would define connectors, dimensions, and protocols, and invited independent manufacturers and creators to participate (the so-called Ara Scouts). This vision also aimed to lower initial costs with a affordable starter kit which would include frame, display, battery, basic CPU and Wi-Fi, and offer an official module store along with the ability to allow third-party modules from software, similar to how Android handles apps from external sources.
Architecture: endos and modules
The system revolves around two pieces: modules and endos. The endo (endoskeleton) is the metal frame that integrates the internal network and fixes the modules; modules They are functional blocks such as battery, screen, processor, storage, cameras, speakers or even specialized sensors (oximeters, night vision, laser pointers or thermal printers).
Various sizes of endo with contained thickness (approx. 9,7 mm): mini, medium and large, with rear slot arrangements of 2Ă—5, 3Ă—6 and 4Ă—7 respectively. Each slot supports standard modules in formats 1Ă—1, 1Ă—2 or 2Ă—2; on the front, the screen and other modules occupy the entire width with different heights. The frame also integrated a small backup battery to allow hot swapping.
For anchoring, the following were used: electropermanent magnets, combining safety and speed when inserting or removing modules without turning off the terminal. The module housings could be 3D print, enhancing aesthetic customization and facilitating replacements.
Development kit and high-speed network
From a technical point of view, the interconnection between modules was based on AraMIPI UniPro, initially implemented in FPGA on an LVDS physical layer. It later evolved into an implementation ASIC with capacitive M‑PHY, with greater efficiency and bandwidth for low-latency communications between blocks such as CPU, GPU, cameras or storage.
The software contemplated a module manager in Android to view, activate or deactivate modules, and even allow combined configurations (e.g., dual camera). In addition, it was proposed that the phone accept by default official modules and that the user could enable unofficial modules from advanced settings, with security and compatibility controls.
What the prototypes taught
Although initially no details were revealed, over time specifications of prototypes such as the model A8A01: Snapdragon 810, 3 GB of RAM, 32GB of storage, 5,34-inch TFT-LCD display (1080p), 3.450mAh battery, 152 x 74 x 12,5mm body and 190 grams, Wi-Fi, Bluetooth LE and NFC connectivity, plus USB‑C and audio jack. There was even a module manager built into Android to manage each component.
In public demonstrations, some prototypes showed limited stability (e.g., crashes at startup), which is reasonable in such an ambitious project. Even so, the tests validated the viability of the hot-swappable modules, magnetic anchoring and high-speed communication between functional blocks.
Technical challenges, regulation and ecosystem
The modular approach involves compromises. Paul Eremenko estimated that the penalty in size and weight would remain below 25% in exchange for flexibility. Added to this are the challenges of regulatory certification (e.g., FCC validation of multiple configurations) and supply chain: coordinating many module manufacturers, ensuring compatibility, and quickly updating the MDK.
On the business side, the platform provided for a very economical starter kit and low-cost frameworks, favoring mass adoption (the ambition was to reach billions of people). A module store with technical curation and a third-party channel, encouraging competition and variety. The ATAP initiative, led by profiles with experience in DARPA (such as Regina Dugan) and with technical leadership from Eremenko, had partners such as NK Labs (electronic and mechanical engineering) and 3D Systems (additive production of housings).
The community was activated with initiatives such as MAKEwithMOTO and programs to recruit developers and testers. Over time, the project slowed down and ended up stopping, but it left solutions and lessons that have permeated other products and repairability standards.
Alternatives and the legacy in the industry
The modular idea didn't go away. Motorola explored Moto Mods in the Moto Z family (batteries, speakers, cameras or magnetic projectors using pogo pins), while other manufacturers, such as the LG G5, tried partial approaches. In addition, proposals such as Fairphone They reinforced the paradigm of repairability and sustainability, aligned with regulatory trends such as easy battery replacement and expanded software support in Android.
Project Ara demonstrated that a smartphone can be conceived as extendable platform And not just as a monolithic device. Although its commercialization never took off, the seed it planted remains present in the conversation about durability, right to repair, and customization, and in interconnection technologies and industrial design that today facilitate longer-lasting and more adaptable products.
