Project Ara keep walking towards him modular smartphoneWe know it's not a simple project, but the truth is that Google's innovation department continues working to make the modular smartphone a reality. The new prototype is spiral 2, and now we can see what it is like printed circuit of this new smartphone.
The printed circuit board, which you can see in the photograph accompanying this post, was seen thanks to the photo published on the Google+ profile of the team currently working on Project Ara. In itself, it doesn't give us much more information about what would be the first commercial modular smartphone of the world. However, it does allow us to see that the project is still moving forward and that the launch is getting closer and closer. Project Ara.
In addition to this, it seems that the company will launch a second version very soon, the 0.20, of the development kit for its modular smartphone, with new details on how they will have to develop the software and hardware for this smartphone. And it is necessary to take into account that the hardware is very relevant in this case. As we said some time ago, Google could be trying to create an open-source world in the world of hardware. It has already achieved this with software thanks to Android, and with Project Ara it could achieve anyone could manufacture components for the smartphone.
In any case, it will be in January when we will have more information about Project Ara, thanks to the two conferences that will take place on January 17 and 24. The company has confirmed that these events can be followed live on live stream, for those who cannot make it to California or Singapore for the events. Possible dates will be published in January. release dates from the modular smartphone to the market.
Source: Google+.
Spiral 2: prototype specifications and scope
The prototype spiral 2 It incorporates a screen with resolution 1280 × 720, a camera of 5 SM, connectivity WiFi y Bluetooth, 3G modem, microUSB port and light and proximity sensors. At the processing level, the team demonstrated compatibility with Marvell PXA1928 y NVIDIA Tegra K1, which reinforces the idea of ​​exchanging computing modules depending on needs
In this phase there were 11 functional modules and a plan to achieve from 20 to 30 options (extra batteries, alternative cameras, auxiliary screens, sensors, audio, etc.). Even a market test initial in Puerto Rico with local operators and mobile points of sale to bring the concept to more users.
Modular architecture: frames, internal network and module types
The heart of the system was the “endo” or metal frame, endostructure with front and rear slots to fit the modules. Google considered three formats with contained thicknesses (around 9,7 mm) and different slot dies:
- Mini: 118Ă—45Ă—9,7 mm, 2Ă—5 layout on the back.
- Medium: 141Ă—68Ă—9,7 mm, 3Ă—6 layout on the back.
- Wide: 164Ă—91Ă—9,7 mm, 4Ă—7 layout on the back.
The rear slots supported sizes 1 Ă— 1, 1 Ă— 2 y 2 Ă— 2, while the front panel featured modules of different heights across the entire width of the frame. The internal interconnection was based on MIPI UniPro about M-PHY, with bandwidth of up to 10 Gbit/s per connection (2x2 modules, with double link, could reach 20 Gbit / s), sufficient for advanced cameras or higher resolution displays.
The modules could be hot extract without turning off the phone and the chassis included a backup battery to allow the main battery module to be exchanged. Initially, they were used electropermanent magnets to secure the blocks, although the equipment evolved towards a different clamping method to improve robustness and tolerances. It also moved from housings designed for Print 3D a customizable covers through molding, expanding aesthetic options without penalizing manufacturing.
In addition to the common elements (camera, speaker, storage, battery), the module ecosystem included options Specialty: since medical sensors to pico projectors, night vision or blocks with physical controls for games. Partners like Toshiba They developed custom chips to free up space on the board and NK Labs y How much participated in the design and integration of the base hardware.
MDK 0.20, conferences, and a certified ecosystem
El Module Developers Kit (MDK) 0.20 detailed electrical, mechanical, and software standards so that third parties could build compatible modules. Google organized developer conferences with main offices and satellites in different cities, in addition to live broadcast to facilitate global access.
The idea was to promote a hardware marketplace similar to an app store, with a certification process to ensure quality and safety. From the factory, the Ara would accept certified modules, although the user could deactivate This restriction on prototypes or experimental pieces. To lower the barrier to entry, a proposal was made starter kit with a very low target cost of materials (frame, screen, battery, basic CPU and WiFi), seeking to attract hundreds of thousands of developers and not just the big manufacturers.
Spiral 3 and the evolution of the modular vision
In the roadmap, spiral 3 added LTE, better autonomy and a system of inductive coupling for contactless data between modules, in addition to integrating antennas and improvements in the chassis itself. Over time, usage studies indicated that many users did not prioritize the modularity of basic functions (CPU, display or main battery), which led to exploring a base phone with non-interchangeable core and modules for complementary functions (alternative cameras, secondary displays or audio).
That turn opened a debate between customization y total repairability. Initiatives such as Puzzlephone They proposed a modularity by “brain, heart and spine”, while Fairphone bet on the simple repair with a high score on iFixit. Later, Ara's program changed course and was put on hold, but its technical legacy and the idea of ​​a open hardware ecosystem paved the way for future customizable devices.
The path Project Ara demonstrates that separating the phone into interchangeable blocks is possible and useful in multiple cases, and that the combination of interconnection standards, marketplace y certification can accelerate innovation and reduce e-waste without sacrificing design and performance.